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PD- 95434
IRF7523D1PbF
l
Co-packaged HEXFET ? Power MOSFET
FETKY ? MOSFET / Schottky Diode
l
l
l
l
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and Schottky Diode
N-Channel HEXFET
Low V F Schottky Rectifier
Generation 5 Technology
Micro8 TM Footprint
Lead-Free
A
A
S
G
1
2
3
4
8
7
6
5
K
K
D
D
V DSS = 30V
R DS(on) = 0.11 ?
Schottky Vf = 0.39V
Description
Top View
The FETKY TM family of co-packaged HEXFETs and Schottky diodes offer the
designer an innovative board space saving solution for switching regulator
applications. Generation 5 HEXFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area. Combining this technology
with International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable electronics
applications like cell phone, PDA, etc.
The new Micro8 package, with half the footprint area of the standard SO-8, provides
profile (<1.1mm) of the Micro8
will allow it to fit easily into extremely thin application
TM
the smallest footprint available in an SOIC outline. This makes the Micro8 TM an ideal
device for applications where printed circuit board space is at a premium. The low
TM
environments such as portable electronics and PCMCIA cards.
Absolute Maximum Ratings (T A = 25°C unless otherwise noted)
Micro8
TM
Parameter
Maximum
Units
I D @ T A = 25°C
I D @ T A = 70°C
I DM
P D @T A = 25°C
P D @T A = 70°C
V GS
dv/dt
T J, T STG
Continuous Drain Current, V GS @10V ?
Pulsed Drain Current ?
Power Dissipation ?
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt ?
Junction and Storage Temperature Range
2.7
2.1
21
1.25
0.8
10
± 20
6.2
-55 to +150
A
W
W/°C
V
V/ns
°C
Thermal Resistance Ratings
Parameter
Maximum
Units
R θ JA
Junction-to-Ambient ?
100
°C/W
Notes:
? Repetitive rating; pulse width limited by maximum junction temperature (see figure 11)
? I SD ≤ 1.7A, di/dt ≤ 120A/μs, V DD ≤ V (BR)DSS , T J ≤ 150°C
? Pulse width ≤ 300μs; duty cycle ≤ 2%
? When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance
www.irf.com
1
02/22/05
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